Master Bond Inc. introduces EP21TDC-2LO, a high performance bonding, sealing, coating and encapsulation system. It cures at room temperatures or more rapidly at elevated temperatures; has outstanding electrical insulation properties; superior thermal conductivity and features exceptional thermal shock resistance. The material has a Shore D hardness of 36; >50 percent elongation; tensile strength of 1,070 psi and T-peel strength of >15 pli. EP21TDC-2LO is available in half-pint, pint, quart, gallon and five-gallon container kits. http://email@example.com
Master Bond, Inc.